SOP Ceramic FLAT Packages

Ceramic FLAT Packages 1.Low temperature glass melting sealing 2.Used in harsh environments,corrosion-resistant 3.Airtight

  Introduction of  Ceramic FLAT Packages

The low temperature flat glass packages are our successfully developed and produced new products which suit SMD SOP and QFP package with only 1/4-1/8 of the volume and weight of DIP packages.

When you need these products, please provide the following information so that we can serve you more effectively

1. Lead Number

2.Width of package

3.Base cavity size L × W

4.Glass sealing temperature range

5.Demand quantity

6.Special requirements for lead

 Feature:

1.Low temperature glass melting  sealing2.Can be used in harsh environments,corrosion-resistant

3.Airtight,easy to package

4.Consists of base,lead frame and lid

5.Types: 8-lead, 14 lead, 16 lead,  20 lead

6.High quality and low cost

Application:

1.Military

2.Microelectronic package which has high requirements on quality-reliablility

Specification

Lines	Name	Specifications	Drawing No.	Cavity(mm)	Peripheral(mm)	Cavity(inch)	Peripheral(inch)	Span(MIL)	ceramic body width	Glass thickness
Lid
8	Flat 8L 02/03 Lid	.170*.153	H8X2-02/03-003	4.30*3.90	6.50*6.00	.170*.153	.256*.236		6.00	0.25±0.03
14	Flat 14L 02/03 Lid	.236*.170	H14X2-02/03-004	6.00*4.30	9.50*6.35	.236*.170	.374*.250			0.25±0.03
16	Flat 16L 02/03 Lid	.236*.170	H16X2-02/03-003	6.00*4.30	10.50*6.35	.236*.170	.413*.250			0.25±0.03
20	Flat 20L 02/03 Lid	.261*.183	H20X2-03.W-005	6.63*4.65	12.90*7.85	.261*.183	.508*.309		7.85	0.28±0.03
Base
8	Flat 8L 02/03  Base	.130*.122	H8X2-02/03-005	3.30*3.10	6.50*6.00	.130*.122	.256*.236		6.00	0.38±0.03
14	Flat 14L 02/03  Base	.154*.122	H14X2-02/03-005	3.90*3.10	9.50*6.35	.154*.122	.374*.250		6.35
16	Flat 16L 02/03  Base	.210*.118	H16X2-02/03-005	5.25*3.00	10.50*6.35	.210*.118	.413*.250		6.35
20	Flat 20L 02/03  Base	.207*.130	H20X2-03.W-006	5.25*3.30	12.90*7.85	.207*.130	.508*.309		7.85	0.40±0.03

SOP Ceramic FLAT Packages