- Contact Person : Mr. Tan Alan
- Company Name : Fujian Nanping San Jin Electronics Co., Ltd.
- Tel : 0086-599-8866289
- Fax : 0086-599-8834768
- Address : Fujian,Nan Ping,233 MIDDLE RING ROAD
- Country/Region : China
- Zip : 353000
SOP Line8 Ceramic FLAT Packages
Introduction of Ceramic FLAT Packages
The low temperature flat glass packages are our successfully developed and produced new products which suit SMD SOP and QFP package with only 1/4-1/8 of the volume and weight of DIP packages.
When you need these products, please provide the following information so that we can serve you more effectively
1. Lead Number
2.Width of package
3.Base cavity size L × W
4.Glass sealing temperature range
5.Demand quantity
6.Special requirements for lead
Feature:
1.Low temperature glass melting sealing2.Can be used in harsh environments,corrosion-resistant
3.Airtight,easy to package
4.Consists of base,lead frame and lid
5.Types: 8-lead, 14 lead, 16 lead, 20 lead
6.High quality and low cost
Application:
1.Military
2.Microelectronic package which has high requirements on quality-reliablility
Specification
| Lines | Name | Specifications | Drawing No. | Cavity(mm) | Peripheral(mm) | Cavity(inch) | Peripheral(inch) | Span | ceramic body width | Glass thickness |
| (MIL) | ||||||||||
| Lid | ||||||||||
| 8 | Flat 8L 02/03 Lid | .170*.153 | H8X2-02/03-003 | 4.30*3.90 | 6.50*6.00 | .170*.153 | .256*.236 | 6 | 0.25±0.03 | |
| 8 | DIP 8L Lid | .175*.157 | CERDIP8-248-01 | 4.44*3.99 | 9.65*6.30 | .175*.157 | .380*.248 | 300 | 6.3 | 0.30±0.03 |
| Base | ||||||||||
| 8 | Flat 8L 02/03 Base | .130*.122 | H8X2-02/03-005 | 3.30*3.10 | 6.50*6.00 | .130*.122 | .256*.236 | 6 | 0.25±0.03 | |
| 8 | DIP 8L Base | .140*.120 | CERDIP8-248-02 | 3.56*3.05 | 9.65*6 |
| SIZE of CERDIP PACKAGE | ||||||||||||||||||
| Lead | Tiles Length | Tiles Width | Base Thickness | Base Cavity Length | Base Cavity Width | Base Cavity Height | Core cavity depth | Lid thickness | Lid Cavity Length | Lid Cavity Width | Lid Cavity Height | Lead frame outside dimensions | total height of the packaged | Upper Lead Span | Lower Lead Span | Lead space | Bade Glass Thickness | Lid Glass Thickness |
| C1 | B1 | H1 | C3 | B3 | H3 | H3+H4 | H7 | C2 | B2 | H2 | C4 | H6 | A1 | A2 | E | |||
| 8 L | 9.66±0.10 | 6.30±0.08 | 1.96±0.08 | 3.56±0.08 | 3.20±0.05 | 0.25±0.05 | 1.27±0.10 | 5.59±0.08 | 4.06±0.08 | 0.48±0.08 | 0.60±0.10 | 22.6-0.05 | ≤4.2 | 7.62 | 9.0±0.5 | 2.54 | 0.30±0.03 | 0.30±0.03 |
SOP Line8 Ceramic FLAT Packages
